Chinese smartphone maker Oppo is expected to officially announce its aesthetically appealing smartphone, R7 on May 20, 2015. According to GizChina, the company has been paying close attention to the exterior details of the device. R7 is expected to feature a bezelless metallic body with a 2.5D curved edge. There were earlier rumors stating that R7 was going to feature a fingerprint scanner, but it appears that the aforementioned function is not going to be a part of the smartphone.
As for the hardware specifications, R7 is expected to feature MediaTek's MT6752 SoC, which is the company's chipset present in devices such as Lenovo K3 Note and Elephone P7000 (these smartphones are able to outpace the capabilities of OnePlus One and feature a price tag that is lower than the latter). The chipset will be running an octa-core processor clocked in at 1.7 GHz. While the following has not been confirmed, it is possible that R7 is also equipped with MediaTek's MT6795 SoC, but these details will be made available once Oppo officially announces the device on May 20, 2015.
The remainder of the hardware specifications include 3 GB of RAM, a 5 inch screen size rendering the 1080p resolution and a Mali-T760 GPU (number of cores have not been detailed). There will be an LTE modem present inside R7. Unfortunately, there are no available details concerning the maximum theoretical speeds of the modem, nor the fact as to what kind of Wi-Fi adapter will be present inside the handset.
A 13/8 MP rear and front camera combo will be present on smartphone. Pricing details are expected to be announced on R7's official announcement date. Keeping the hardware specifications in mind, the smartphone will most likely be carrying a competitive price/performance ratio in order to make the mobile device affordable for a wider audience.
