Samsung is doing everything that needs to be done to make sure that the smartphones it puts out will be top-notch. The South Korea-based tech firm is applying the same principle to the much talked about Samsung Galaxy S7, which is why it may end up sporting a heat pipe.
According to a brand new report, the company is figuring out a way to dissipate heat under the device's hood so as to prevent overheating issues, which was the center of the complaints about the Qualcomm Snapdragon 810 processor that Samsung did not end up using for the Galaxy S6.
Interestingly, reports claim that the Samsung Galaxy S7 units will come with its very own Exynos 8890 processor and Qualcomm's new generation chipset, Snapdragon 820. The latter was recently attached to an earlier report claiming it is also overheating, a report that the manufacturer denied as per Phone Arena.
If Samsung is still going to use Snapdragon 820 for its flagship, it is understandable that it is mulling over integrating a heat pipe. It may also just be an effort to keep the flagship in pristine condition as the processor hums under the hood.
Either way, Samsung is allegedly already testing heat pipes of different shapes and kinds that will best complement and improve the performance of the Samsung Galaxy S7. By the end of the year, the tech firm will make its mind up about pushing through with the heat pipe integration.
As for other specs of the premium smartphone on the way, it is being said that it will get two variants – one with a 5.2-inch display and the other being dubbed as the Galaxy S7 Edge sporting a 5.7-inch curved display.
Samsung is expected to lift the veil off the device in January as part of its new plans to release its next offerings in a much earlier schedule than the traditional they went by for years.
