Taiwanese smartphone maker HTC is attempting to repeat the same success that it did with its One M8 smartphone by releasing two flagship devices at the Mobile World Congress at Barcelona on March 1, 2015. While it can already be speculated that the One M9 smartphone will be equipped with impressive hardware specifications, additional leaks have sprouted up which suggest that HTC's upcoming offering will be armed with an impressive camera sensor as well as a Bluetooth 4.1 module.
HTC's ROM Developer LlabTooFeR, who tweeted from his official Twitter account, stated that the upcoming handset will be coming with impressive connectivity options and camera upgrades at the event. The HTC One M9 is expected to come with a 20 megapixel camera sensor.
Samsung's Galaxy S6 Edge and the regular Galaxy S6 are tipped to be equipped with the same camera resolution as HTC's upcoming smartphones. While this has yet to be confirmed, it is expected that the HTC One M9 will be shipping out in two chipset variants; one will be a Snapdragon 810 chipset, which will be targeted to the North American and European regions while the lesser performing MediaTek chipset will be targeted to regions like China.
Coming back to the HTC One M9's hardware specifications, LlabTooFeR has reason to believe that the handset will be using a 20 MP Toshiba T4KA7 camera module for its smartphone, with an aperture width of f 2.4. The Toshiba sensor, if assimilated to the upcoming smartphone, will be considered as a sizable upgrade over the dual camera sensors present on the One M8.
HTC's collaboration with Google in rolling out the Nexus 9 also means that the company will be looking to adopt a Broadcom BCM4356 wireless module on the HTC One M9. This wireless module will support the 802.11 ac wireless standard and Bluetooth 4.1 connectivity.
