The iPhone 7 is expected to be the thinnest Apple offering yet, if the latest report about the Cupertino-based tech titan's plans is anything to go by.
Apple is reportedly working on a new technology called "fan-out packaging," which simply allows chips to be more powerful as they get smaller. This technology will reportedly be applied on the antenna switching module and radio frequency chip of the iPhone 7. The result will be a slimmer iPhone, longer battery life and improved signal strength.
With fan-out packaging, Apple should also be able to put together components of the iPhone 7 in a way that will make them more efficient.
While there's no way of knowing for sure if fan-out packaging will be a thing for the iPhone 7 when it releases, reputable KGI Securities analyst Ming-Chi Kuo offered details on what the next iPhone will look like.
"We expect the 2017 new iPhone model to adopt a structural design similar to that of iPhone 4/ 4s, meaning it will be equipped with glass on both the front and back sides, and a metal frame surrounded the edges," Kuo told investors, as quoted by Macrumors.
Kuo added that Apple will offer an iPhone 7 Plus version with a 5.8-inch AMOLED display, which makes it relatively larger than the 5.5-inch iPhone 6s. This will reportedly be the standard size for upcoming Plus versions of iPhone flagships, but the regular one will still be at 4.7 inches. However, with the device's curved glass, Kuo believes the iPhone 7 Plus will look smaller than the current flagship.
Other specs and features expected to be on the Apple iPhone 7 is a facial or an iris-scanning biometric security technology and wireless charging. Whether or not all this comes to past, users will know for sure next year.
