HTC Corporation's new virtual reality technology headset called Vive is expected to be unveiled officially this coming October, according to a recent report by Tech Radar.
The HTC Vive has been in development by the Taiwanese company in collaboration with software developer Valve. The new device was first unveiled earlier this year at the Mobile World Congress (MWC) 2015 event held in Barcelona, Spain.
Recently, an HTC Vive developer version was reportedly revealed alongside the company's new wireless controllers during this year's Comic-Con event that took place in San Diego, California. Those who attended the recent event were given a chance to test the new virtual reality headset in action before it releases.
"We are targeting mid-October, but have not yet finalized the event details, venue, etc," said HTC's Executive Director of Global Marketing Jeff Gattis in regards to the headset launch. "Our hardware development, for the consumer versions of both the HMD and wireless controllers, remain on schedule for the end of 2015," he added.
Gattis continued, "We remain committed to what we said at our keynote in Barcelona back in March, that is, the first consumer units will be on sale and in the hands of customers before the end of this year."
In terms of the specifications and features, IT Pro UK reports that the HTC Vive comes with a 1200 x 1800 per eye resolution with a 90 frames per second (fps) rating. The report adds that the new device uses a "laser position sensor" technology to detect a user's head movement and at what direction he or she is facing. Other specs include an accelerometer and a gyroscope.
In addition, it is expected that the new HTC Vive will come with unique sensors capable of tracking a user's position within a location and enable him or her to interact with the virtual environment.
Another new device developed by HTC and unveiled during this year's MWC event is the HTC Grip fitness band. The HTC Grip band is expected to arrive anytime soon since it has recently received Bluetooth certification by the SIG.
