Leshi Internet Information and Technology or better known as just Le has become one of the emerging brands in the smartphone arena and is said to be releasing another handset under its so-called Cool lineup.
Expected to don the name LeEco Cool, the phone is said to be a follow-up to the LeEco Cool1 Dual that came out three months ago. It is said that it will be a midrange handset that will cater consumers who prefer decent-performing devices that have value for money.
Moreover, reports regarding the yet to be unveiled smartphone have been circulating online as of late as photos of the handset were released by the China-based device regulatory board known as TENAA.
For those unfamiliar with the brand; Le, together with fellow Chinese phone maker, Coolpad Group, teamed up to devise the Cool1 Dual. Having said that, both companies are collaborating once again to release another device under the Cool product line.
Specs of the smartphone are still quite sketchy as of the moment. However, if recent reports are to be believed, the LeEco Cool is rumored to don varying amounts of random access memory (RAM) with either 4 GB or 6 GB. Furthermore, its memory storage will also vary with 128 GB as its top brass version.
Also, it is said that the handset will sport a 5.5-inch multi-touch HD display and will be powered by a Snapdragon 821 processor from Qualcomm clocked at 2.35 GHz. It will still be preloaded with the Android 6.0 Marshmallow operating system, though it's highly probable that it might be tweaked to Nougat via an over-the-air update.
Meanwhile, there are fears that the phone might not actualize as Le's chairman, Jia Yueting, admitted that the company is currently enduring some financial hardships due to expansion costs.
